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Why select Laser?

PCBA laser depaneling is non-contact process technology, with no mechanical stress, no consumable worn blades, no die cost, no damage to the components, high precision.

Software control, user-friendly, the contour can be easily programmed, and the cutting pattern can be easily defined. The vision system can make accurate marking position recognition. No realignment is required between the switch of different types of panels.

CO2 or UV?

The PCBA laser cutting speed of the CO2 Laser is faster and at a low cost than UV, but CO2 cutting will have more charring on the cutting edge, and the kerf width is larger than the UV process.

The UV laser is 355 nm wavelength, with a “cold marking” method. The laser beam diameter is only 20 μm after focusing. The pulse energy of the UV laser act on the material is in a microsecond. There is no significant thermal influence next to the slit, so there is no damage to the electronic component caused by the heat generated.

UV Laser is suitable for rigid, flexible and rigid&flexible substrate cutting and marking, like FR4 substrates and imitation resin-based materials, polyimide, ceramics, PTFE, polyester, aluminum, brass and copper, etc.

PCB Laser Marking

PCB laser marking can mark various characters, symbols and patterns, etc. The characters’ size can range from millimeters to micrometers, which can realize the function of anti-counterfeiting. Besides, laser marking can also process serial numbers and QR codes to record related production information, facilitating the complete traceability and quality control of electronic products.

Compared with traditional inkjet marking, PCB laser marking is more environmentally friendly.

A fully automated PCB Laser marking machine is widely used in the circuit board industry, mainly for assembly line marking operations on integrated circuit boards and semiconductor components, including text or graphic marking. Due to the non-contact processing method, no mechanical pressure is generated. The Laser-focused beam is tiny, which can be used for fine processing of small components, including integrated circuits, crystal oscillators and capacitors.

PCB Laser Decoating

In the process of making the PCB board, when the electronic components inserted on the PCB board are tested to be defective, they need to be removed and replaced with a good product. Before replacing a good product, remove the glue that sticks to the defective product on the PCB. The traditional method of Manual grinding or scraping is used, which is time-consuming, laborious and insufficient removal, and the yield of PCB boards after this processing method is not high.

The laser glue removal method is environmentally friendly, no chemical pollution, fast processing speed, it can significantly improve production efficiency.